Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material

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Witgain Technology Limited

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Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material

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Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material

8 Layer HDI PCB FR4 Material Blind And Buried Holes High TG170 Main Features: 1 8 Layer HDI PCB with blind and buried holes. 2 Green solder mask and immersion gold treatment. 3 Min hole size is 0.1mm ...

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Blind Holes Rapid Prototyping PCB

Buried Holes Rapid Prototyping PCB

TG170 FR4

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